Introduction:

  Our new ci220 is a state-of-the-art contact interface test tool built around a fast signal generation and acquisition system interfacing to the smart card via carefully designed analog circuitry.

  The ci200 provides full testing flexibility. The production line testing program can be changed in seconds and any of the 24 contact pins is capable of performing any interface or electrical test. The user can handle up to 32 test heads in full parallel. Either contact, contactless or both can be used with every mounted test head, at the same time.

  An SDK evaluation kit consisting of a rack with two dual interface test heads managed by a controller allows its implementation in the physical and software environment of the user. From simple functional tests to capacitance or consumption measurement, all functions are provided by the tester to meet the customer’s testing plan

  Whatever the application, a multitude of available protocols are supported and can be used in full parallel, including ISO 7816 (T=0 and T=1), I2C, I3C, SPI, ISO 14443 and ISO 15693. The robust architecture of the ci200 simplifies the integration with the machine host PC of the micro module handler,” Binder adds. “The controller of the ci200 delivers test and pre-customization information in real time so that quality control at input and output is optimized.

Architectural benefits:     Highest testing speed due to the groundbreaking new architecture      No external mux required to re-assign logic to the same pin (e.g. I2C_SCL / SPI_SCK)      All interfaces can be operated in parallel Supported Standards      Contact: ISO7816, I2C, SPI, I3C, SWP      Contactless:ISO14443A/B,15693,18092

Tester Config     Single Module – 2 Dual interface test heads     2 x RF in/out – Coax Bus     2 x RF in (50Ω) – Coax Bus      2 x Contact interface (24 pins each) – Coax Bus      Coax cables for RF & contact      Up to 1m cable length to test head